GS-600 is a high-speed, high-precision, full-automatic in-line dispensing system, developed mainly for semi-conductor packaging and SMT’s latest dispensing process. The system uses the marble frame structure(more stable), the linear motor drive(more efficient), piezoelectric jetting valve and class-100 dust-proof design, to meet the industry’s more and more demanding requirements in dispensing process and system stability.

Mainly applicable to the wafer/chip’s 1st level packaging under-fill, overfill, edge-bond, and SMTs 2nd level under-fill, en-cap, overfill, etc.

The system integrates various processing accessories, with multi-function combinations/choices such as bottom heating, automatic weighing, automatic cleaning, Laser height sensor, in-line UV exposure, plasma guns.

Meanwhile, based on the features of semi-conductor packaging and SMT industry, below functions can be optional: the front-end process’ pre-heating and materials checking. The back-end process thermal insulation and quality inspection, in order to improve the intelligence level, production yield and system stability.