KPS2000
Jetting Dispenser

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KPS2000

Jetting Dispenser

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KPS2000

Dispenser/Jetting Dispenser Core Process Components

The KPS2000 is a jetting dispensing system that enhances precise control compared to traditional piezo
jetting valves, with added convenience through its ADJ functionality.
This product continues to dispense a wide range of liquids and achieve excellent results,
as seen with previous jetting valves, while the ADJ feature improves ease of use in the manufacturing
process and reduces processing time

KPS2000

Dispenser/Jetting Dispenser Core Process Components

The KPS2000 is a jetting dispensing system that enhances precise control compared to traditional piezo
jetting valves, with added convenience through its ADJ functionality.
This product continues to dispense a wide range of liquids and achieve excellent results,
as seen with previous jetting valves, while the ADJ feature improves ease of use in the manufacturing
process and reduces processing time

Features & Advantage

  • The contact point between the rod guide seat and the chamber seat has been changed to a threaded connection, improving the stability of the rod axis for more consistent movement.
  • Components are adjusted with quantitative measures, with each scale size specializing in precise control at 0.01 mm intervals
  • The enhanced ADJ functionality increases the accuracy of the nozzle adjustment module
    RP, allowing for quick and convenient nozzle calibration.
  • The impact force of the valve body has increased by 20%, reducing the valve opening time
    to 0.01 ms and improving the precision of glue points

Standard Configuration

Optional Configuration

· Hot Melt Adhesive Dispensing Uni

Optional Configuration

· Hot Melt Adhesive Dispensing Uni

Typical Applications

· Wafer level packaging

· Camera Module

· Flip Chip Underfill

· High-Density PCB Underfill

· BGA and Chip Scale Package Underfill

· BGA and chip level packaging(CSP) underfill

· Micro Speaker and Receiver

· AF Motor (VCM) and Vibration Motor

· Corner and Edge Bonding

· Daming and filling

· Surface mounting

· Conductive Epoxy

Typical Applications

· Wafer level packaging

· Advanced camera module(CCM)

· Flip chip(FC) underfill

· High density printed circuit(PCB) underfill

· BGA and chip level packaging(CSP) underfill

· PoP underfill

· Micro speaker and micro receiver

· IVHcro focusing motor(VCM) and flat motor

· Corner and edge bonding

· Daming and filling

· Surface mounting

· Electrical conductive epoxy resin

SPECIFICATIONS

Model KPS2000 Piezoelectric valve
Pressure supply range 0.1~8 Bar
Viscosity range Medium or high viscosity up to 500,000mPas
Max jetting frequency 1200Hz
Work temperature range 10～50°C
Corrosion resistance All aqueous media, organic solvents, weak acids and alkali
Dimensions (mm) 40W × 20D × 125.5H（No Runner Assembly Included）
75W × 20D × 125.5H（Includes Runner Assembly）
Weight 430g (Fluid Box applied, cable excluded)

 

Model KPC2000 controller
AC power input AC 220V±20%

0.01ms~6000.00ms，0.01ms
Jetting frequency 1~1200HZ
Settings display TFT-LCD color screen

10 set
Reserved interface Supporting STD. RS232/RS485 MODBUS RTU agreement
Weight 3.55KG
Dimensions (mm) 232W × 170D × 165H
Power 275W